MountAIn SAS, an AI orchestration company recognized with a 2026 CES Innovation Award, has partnered with Alif Semiconductor to advance computer vision capabilities for extreme edge AI applications.
TDK Corporation has introduced SensorStage, a comprehensive evaluation platform developed to simplify and accelerate the design and analysis of its SmartMotion inertial measurement units (IMUs). The ...
Embedded.com is hosting the annual Embedded Systems Design (ESD) Tech Forum virtual event. The two-day conference, scheduled for April 28-29, will focus on several key areas of innovation including ...
Microchip Technology Inc. has extended its dsPIC33A digital signal controller (DSC) portfolio with the dsPIC33AK256MPS306 series, targeting high-efficiency power conversion, advanced motor control, ...
The surge in complexity of modern SoCs, driven by the integration of heterogeneous compute elements, advanced packaging techniques, and stringent power and performance demands, has led to an ...
Qualinx B.V., a spin-off from TU Delft, recently announced that it is scaling its ultra-low-power global navigation satellite system (GNSS) chip for mass production in 2026. Built on the company’s ...
GF is now a crucial part of the supply chain to keep up with the shift to software-defined vehicles in the automotive sector. With the recent Renesas-GF partnership, GF is now responsible for ...
Siemens has introduced the Questa One Agentic Toolkit, an extension of its Questa One smart verification platform to accelerate register-transfer level (RTL) design and verification using agentic AI.
Cadence Design Systems Inc. has launched an agentic AI solution for automating front-end silicon design and verification. Claiming the first agentic workflow for automating chip design and ...
The Qualcomm Dragonwing IQ10 is the premium-tier robotics chip for advanced autonomous machines. The chipset features an 18-core Oryon CPU paired with an AI engine to deliver up to 700 TOPS ...
Bosch Sensortec unveils its BMI5 platform motion sensor platform at CES 2026. This new generation of inertial sensors delivers high-precision performance for a range of applications, including ...
NXP Semiconductors N.V. and Rimac Technology, a Tier 1 supplier of control systems, are partnering to drive centralized architectures tailored for software-defined vehicles (SDVs). This joint solution ...
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