Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Abstract: A dynamic model for the driving mechanism of high voltage circuit breakers is coupled to a two-dimensional(2D) axisymmetric arc model through a transmission system of three-dimensional ...

Abstract: In the context of carbon neutrality, oilfield enterprises have the difficult task of increasing the rate at which clean energy is utilized, enhancing electrification, decreasing the unit ...