Support from the Lassonde Family Foundation will enable a reimagined campus hub in the School of Engineering complex for ...

New funding will help Astrus expand its team and deliver AI tools that accelerate chip development for leading semiconductor ...

As packaging integrates diverse substrates, adhesives, and exotic metals, manufacturers must rethink precision from the ...

The design-bid-build delivery model has been the backbone of U.S. construction for decades, but today’s more complex projects ...

The semiconductor industry stands at the forefront of technological innovation, driving the digital transformation that powers our modern world. As process nodes continue to shrink and design ...

From low-friction coatings to ultrasonic clamp load testing, early design integration and advanced joint analysis are ...

A $16.75 million donation will support the renovation of the Prince Lab into the Lassonde Innovation and Design Hub, Brown ...

Industry experts outline how SPE simplifies data and power transmission, reduces cabling complexity and enhances integration ...

Plastics are everywhere—in the packaging around your food, the insulation in your home, and even the parts of your phone.

Researchers at Lehigh University are exploring tiny lab-grown brain organoids to unlock the secrets of the brain’s efficiency ...

RS, a global product and service solutions provider for industrial customers, have launched the DesignSpark PCB version 13.

The Norfolk City Council voted this week to provide approval for the city and the Nebraska Department of Transportation (NDOT ...