The mechanical strength and toughness of engineering materials are often mutually exclusive, posing challenges for material design and selection. To address this, a research team from The Hong Kong ...

2DL and 3DL are made from thermoplastic films applied over a substrate like MDF or particleboard to create a panel or contoured component. Vinyl and polyester are the most common materials. They are ...

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. Meeting yield and product cost targets is a continuous challenge, due to new device ...