This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...

“This process can be automated and is very flexible. We can apply the solder downwards or from various other angles and in places that are difficult to access,” says Beckert. Solder bumping is much ...

Silicon Precision Industries (SPIL) and Xilinx jointly announced the successful development of 12-inch wafer solder bumping for flip-chip packaging. With Xilinx as technology partner, SPIL began to ...

Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...

A potential breakthrough technology from Nextreme (Research Triangle Park, NC)—a microscale thermal and power-management device manufacturer—integrates cooling and power-generation capabilities into ...

At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described ...