JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...

Modules and system-in-packages (SIPs) continue to deliver functionality and performance while simplifying system design. System-on-module (SOM) and system-in-package (SIP) solutions were out in force ...