SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) will present the latest in load port and flip chip technology at Booth 1926 in the South Hall at the SEMICON West Conference 2019, July 9 ...
SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) will present the latest in loadport and chip flip technology at Booth 1905 in the North Hall at the SEMICON West Conference 2018, July 10 ...
HANMI Semiconductor said on the 22nd that it has launched the "Big-Die FC (Flip Chip) Bonder" and will supply it to global customers. By supplying a mass-production 2.5D advanced packaging bonder, ...
Die-bonding at up to 60,000 flip-chips per hour, is what ITEC is claiming for its ADAT3 XF TwinRevolve. “Instead of the traditional forwards and backwards up-down linear motion, the new die bonder ...
Eindhoven-based TNO and BE Semiconductor Industries NV (Besi) are developing a production die bonder for the 3-D chip stacking market, with the first prototype expected to be ready by the second half ...
CAMBRIDGE, UK — Sensor Products highlights the benefits of its Pressurex pressure-indicating sensor film as a convenient and repeatable, low cost control means for both bonding and coplanarity.
In packaging applications for cellular electronics devices, the use of flip chip copper pillar bumps has been expanding due to its better shape, lesser thickness, smaller form factor, better ...
On the 14th, Hanwha Semitech signed a TC bonder (thermal compression bonding equipment) supply contract with SK Hynix worth 21 billion KRW. The semiconductor industry generally considers this not to ...
GRENOBLE, France--(BUSINESS WIRE)--CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such ...
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