SANTA CLARA, Calif. — Intel Corp. has developed a packaging technology that embeds a processor die into a specialized, pc-board-like package, getting rid of solder bumps and much of the interconnect ...

Raptor Lake hasn't arrived yet, but that didn't stop Intel Meteor Lake gaming CPU packages from making an appearance at the company's Vision event. The showcased chips give us a glimpse at the 14th ...

During Intel's Architecture Day briefing they teased a new interconnect technology, which aims to replace EMIB as their go to for linking and even stacking devices on a package. Intel has made great ...

Placement of regulators for core voltage levels closer to the chips that need them Usage of unique materials like ECMs in PCBs and packages to provide power rail capacitance Package-level and ...

Given its recent manufacturing troubles, a resurgent AMD, an incursion from Qualcomm, and Apple’s shift from customer to competitor, it’s been a rough few years for Intel’s processors. Computer buyers ...

Intel has revealed that it's experimenting with direct CPU water cooling, where an Intel CPU package has a waterblock built onto it to remove as much heat as possible from the chip. The company has ...