SANTA CLARA, Calif. — Intel Corp. has developed a packaging technology that embeds a processor die into a specialized, pc-board-like package, getting rid of solder bumps and much of the interconnect ...

Intel presented its sophisticated packaging solutions, namely EMIB (Embedded Multi-Die Interconnect Bridge) and Foveros. The company also introduced the Meteor Lake processor which incorporates ...

Intel has revealed that it's experimenting with direct CPU water cooling, where an Intel CPU package has a waterblock built onto it to remove as much heat as possible from the chip. The company has ...

During Intel's Architecture Day briefing they teased a new interconnect technology, which aims to replace EMIB as their go to for linking and even stacking devices on a package. Intel has made great ...

Intel has announced that upcoming generations of its processors, including the Panther Lake and Nova Lake series, will no longer use the Memory on Package (MoP) package-level memory solutions found in ...